Product or Service
2.4ghz wireless mouse
Profile:Manufacturer - Producer|Ref:PSL136478YH | Country: China | Currency: usd | Export: No
2.4GHZ WIRELESS MOUSE
1.Nano very fine receiver, plug and play, no need to code the intelligent connection technology
2.2.4GHz provide wireless operation of the farthest distance of 10 m
3. Power Switch
4. 800/1600cpi adjustable cursor speed
5. Receiver collections, easy to carry
6. Low voltage alarm
7. Wireless Carrier Frequency: 2402MHz-2480MHz
8. Working group frequencies: 16, automatic frequency hopping
9. Rated voltage: 3V
10. Rated power: 13mA
11. Searching system: optical
12. Maximum acceleration: 14 inches / sec
13. Resolution: 1200CPI/1800CPI
System support: Windows98se / WindowsME / Windows2000/WindowsXP / Windows2003 / Mac
we sincerely known there are many mouse supplier,but wish you would love to check our wireless mouse technology and chip pls.
firstly we used all wireless mouse with SUNPLUS chip,you known MICSOFT AND SONY world brand mouse used the chip.
we concern the wireless mouse quality deeply,that's why we used the same chip.
secondly there are 2 technologies in China market for 2.4Ghz wireless mouse as bellow:
SMT (Surface Mounted Technology),
Surface mount technology (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount devices or SMDs. In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board.
An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
COB(chip on board).
The most common interconnection method is the Chip On Board (COB). In the electronic systems, it offers the possibility to integrate more functions in the same volume to fit to a limited place.
The silicon chip is glued directly to the substrate and then connected by bonding with an aluminum wire or a gold wire with a diameter from 17.5 to 50 µm (no exhaustive list). An encapsulation resin (Glop top) can be dispensed on the unit or locally to guarantee stability against thermal and mechanical efforts, and to protect the assembly.
we used SMT technology to guarranty our quality,wish you like our products ,quality and unite price.
warm welc. your kind feedback and comments
also wish you can inform me you prefer modle and all your requist pls.
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