Product or Service

Pulse Heat FOG/FOB Bonding Machine

Profile:Manufacturer - Producer|Ref:PSL81909YH | Country: China | Currency: | Export: No

Currency :
country : China

The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.
Basic Parameter
Voltage:AC220V 50-60HZ
Rating Power:1.5KW (constant heat) 4kw (pulse heat)
Operation Mode:7" interface
LCD Table:Servo memory and auto-location system
Input Gas:0.4-0.8Mpa
Fixture:Micrometer adjust X-Y-θaxis
Bond Head :60 mm(constant heat) 50mm(pulse heat)
Thermocouple:K type
Rolling Mode:Auto
Program Control: PLC and servo controller
Vision System:Two C/L CCD
Heat Mode: Constant heat and pulse heat
Weight: 300kg
Dimension:(L)1200 x (W)895 x (H)1440mm

Information Stock : Product in stock
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