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Profile:Manufacturer - Producer|Ref:PSL4962YH | Country: China | Export: No
The ¡°PCB¡± category contains many influential factors on the overall solder joint reliability including: pad metallurgy, board thickness, pad size, base material, via formation
technology, routing method (via in pad versus fan out), PCB layer count, soldermask technology, and pad definition versus mask definition. The ¡°components¡± sub-group
parameters that influences the assembly reliability may include; construction (flex versus rigid carrier etc.), die size to package ratio, solderball size, attachment pad size and definition, base materials, package size, and ball configuration.
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