1.Max dimension:630 * 530mm
2.Copper thickness of inner layer:18-140um
3.Copper thinckness of outer layer:12-210um
4.Min.Annular ring:0.10mm
5.Min.solder mask clearance:0.05mm
6.Min.solder mask cllearance:0.045mm
7.Impedance tolerance:+/-10%
8.finished board thinckness:0.25mm-3.5mm
9.outline precision:+/-0.1mm
10.Surface finished type:HASL.Flash gold,ENIG,OSP(lead free compatible),Carton Ink,peelable S/M,HASL(lead free) etc.
11.Products type:High precision ,multi-layer,blind hole board,buryed hole board,high frequancy board,Aulminium Backed board
12.Base material:FR-4,ALUMINIUM-BLACKED BOARD,HALOGEN-FREE ,LEAD-FREE COMPATIBLE,HIGH TG,HIGN CTI,CEM-1,CEM-3
13.Layers:2-12layers
14:Inner layer corcuit:4/4mil
15.Out layer circiut width/spacing:4/4mil
16.Board thinkness:0.1-1.6mm
17:Min.drill bit size:0.2mm
Aspect ratio:8:1
