Features:
Base material: aluminum
Layer count: single-sided
Board thickness: 2.50mm (finished)
Base material thickness: 1.50mm
Copper thickness: 2oz
Surface finish: immersion gold
Solder mask color: white
Size: 60 x 60mm/1 up
Available base material: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (maximum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishes: HAL, ENIG, OSP, gold finger and chemistry tin
Possible solder mask colors: green, black, white, yellow and blue
Board dimension: 600 x 1,000mm
Hole diameter: 0.2mm (minimum)
Line width: 0.075mm (minimum)
Line spacing: 0.075mm (minimum)
SMT pitch: 30 degrees (minimum)
Annular ring: 0.05mm (minimum)
Aspect ratio: 11:01
Surface/hole plating tolerance:
Hole tolerance (PTH): 0.25mm
Hole tolerance (NPTH): 0.15mm
SM tolerance (LPI)
With electrical test
RoHS directive-compliant
SMT device mounting is available
