- surface finish: HASL, Immersion Gold, Gold plating, OSP, Immersion Tin etc.
- layers: 2-30
- Minimum Line width: 3mil
- Minimum Line space: 3mil
- Min space between pad to pad: 3mil
- Minimum hole diameter: 0.10mm
- Min bonding pad diameter: 10mil
- Max proportion of drilling hole and board thickness: 1: 12.5
- Max size of finish board: 23inch*35inch
- Rang of finish board’s thickness: 0.21-7.0mm
- Minimum thickness of soldermask: 10um
- Soldermask: green, yellow, black, blue, white, red, soldermask
13.Minimum linewidth of idents: 4mil - Min height of Idents: 25mil
15.color of silk-screen: white, yellow, black, green
