Our Services Include
1.New Product Design & Development (Electronic & Mechanical)
2.Prototyping and Pre-production
3.Surface Mount Technology (SMT) & Ball Grid Array (BGA) with repair capability
4.Through Hole Assembly
5.Coating and Potting
6.Casing Assembly / Complete Unit Assembly
7.In-circuit Testing, Functional Testing, and System Testing
8.Packaging and Distribution
9.Programming of Micro Controllers, Memory Devices, and Programmable Logic