Mobile mother boards(HDI PCB)
Base-material: FR-4
Board thickness: 1.0MM
Six layers-HDI(1+4+1) Blind via hole
Solder mask color: Green
Liquid Photo Imageable Soldermask(LPI)
Silkscreen: White(top)
Surface Finish: Immersion Nickel gold + OSP(Entek)
Profile: Routing
E-test: 100% Fixture
Quality report: Solderability test, Final inspection and Microsection
Model NO.: ROHS compliant
Standard: IPC-6012 Class 2, SGS, ISO9001, UL approved
Productivity: 100,000pcs/month
Trademark: HX