Manual Chip Re-bonding Machine

 Feature Description
This machine is designed for manually bonding the copper wire onto the contactless chip. The amplifier and display is equipped to ensure precise and quality bonding result. It is necessary equipment in the process of contactless INLAY sheet or contactless card production.

 Technical Parameters

1. Speed: 2000 pcs per hour.
2. Dimension: L500×W400×H500mm
3. Weight: 60 KG
4. Power supply: AC220V 50/60HZ