Micro UDP USB3.0 flash drive chip
Characteristics of COB/UDP USB flash drive:
A new production method for USB flash drive
Flash chip is assembled on board together with controller, solution and accordingly software tackling.
The assembled board can be used for whole USB flash drive function, also can be put almost USB flash drive cases.
Based on this production procedure, the defect ratio is pretty few and the quality is more stable than regular SMT production.
Super thin and small size
Better water-proof and shock resistance function
Difficult fixed
Specification:
Super smaller size: 15(L)11.3(W)1.8(H)mm
Capacity: 8GB/16GB/32GB/64GB/128GB
USB interface standard: Super speed USB3.0- up to 5Gbps (10 times speed than the speed of USB2.0)
Compliant with USB2.0 and backward compliant with USB 1.1
Full duplex transmission mode: Adopt a new bi-directional data transfer mode
Communication parties can simultaneously send and receive data in order to transfer the data with higher speed.
Easy and fast to assemble
Flexible for production line setup
Powered by USB bus directly
Hot plug & play
Shake protection
Electromagnetic wave protection
Password protection function, auto-run function, bootable function, Readyboost function and data protection function available
Supports USB HDD, USB ZIP dual boot mode
Operation systems supported: Windows 98/ME, 2000/XP/Vista, Mac OS 9. X/X, Linux 2.4X or above versions
Technique parameters:
Power： USB bus powered（4.5V~5.5V）
Erase cycles: 1,000,000 times
Minimum data retention: 10 years
Operation temperature range: -10℃ to +55℃
Storage temperatature range: -20℃ to +55℃
Operating Humidity: 20% - 90%
Storage Humidity: 20% - 93%
Shock resistance: 1,000 g
Certificate:
CE
FCC
ROHS
WEEE
Quality warranty term:
5 years
