Edge Defect Length＜＝5mm, depth＜＝0.5mm (Max 1 pcs/w)
Saw mark ＜＝30μm (depth)
Crack and pin holes No cracks and pin holes
Micro-crack,pitting holes and inclusions No non-penetrating & penetrating micro crack, inclusions and holes
Surface cleanliness As cut and cleaned , No stains , scratch, contamination , watermark and fingerprints
Angle between square sides 90±0.3 deg.
Bevel edge width (hypotenuse) 0.5~2 mm
Bevel edge angle 45+/-10 deg.
Length of wafer edge 156+/-0.5mm
Thickness 200 ± 20μm
TTV ＜＝50μm
Bow ＜＝70μm
We can supply 156 * 156 ,Multi Wafer , produced in Taiwan,1.75 USD/piece FOB. If need to the detailed specification please inform E-mail or fax.
