Production capabilities:
Board Size: 610mm*1200mm
Layer Count: 1-30 layers
Base Material: FR-4, High Tg FR-4, CEM1, CEM3, Aluminum, PTFE
Copper Thickness: 0.5oz - 3 oz
Board Thickness: 0.2mm-6.0mm
Min Line Width/Space: 3mil
Min Hole Diameter: 0.02mm
Surface Finishing: HASL, PB Free HASL, ENIG, Flash Gold, Immersion Tin, Immersion Silver, OSP
Solder Mask Color: Green, Red, Blue, Black, Yellow, White etc.
Legend: White, Black etc.
Apect ratio:10:1