PCB ABILITY :
1.Suface finish :lead free HASL,Immersion Tin/Gold,Etc.
2.Layer :2-30layer
3.Min line width :3mil
4.Min line space :3mil
5.Min space between pad to pad :3 mil
6.Min hole diameter :0.1mm
7.Min bonding pad diameter :10mil
8.Max propotion of drilling hole and board thickness:1:12.5
9.Max size of finish board :23*35inch
10.Range of finish board thickness:0.21-7.0mm
11.Min thickness of solder mask :10um
12.Solder mask :Green ,Yellow ,Black,Blue,White,Red etc.
13.Material of PCB:FR4,HIGH TG FR4,ROGERS ,CEM-1,ARLON ,TACONIC,PTFE,etc.
14.Data file format :GERBER FILE AND DRILLING FILE,PROTEL SERIES ,PADS2000 SERIES,POWER PCB.
15.Testing:100% E-Testing,high voltage testing
