Specifications:
Base material: FR4
Layer count: double-sided board
Board thickness: 1.0mm
Copper thickness: 70um
Surface finishing: HASL
Soldermask color: red
Size: 154.2 x 62.3/2up
Technical parameters:
Surface treatment: HASL (LF), immersion gold, flash gold, OSP, immersion tin, immersion silver, HASL and gold finger, selective nickel
Laminate: CEM-3, PTFE, FR-4 (high TG and more), metal base (AL, CU and more), Rogers and more
Layers: 16 layers (maximum)
Board size: 20 x 48-inch (maximum)
Board thickness: 0.4 to 5.5mm
Copper thickness (maximum):
Inner layer: 4oz
Outer layer: 5oz
Track width: 4 mils/0.1mm (minimum)
Track space: 4 mils/0.1mm (minimum)
Hole size: 8 mils/0.2mm (minimum)
Laser hole size: 4 mils/0.1mm (minimum)
PTH wall thickness: 0.8 mils/20um
PTH diameter tolerance: ±3 mils/76um
NPTH diameter tolerance: ±2 mils/50um
Aspect ratio: 10:1
Impedance control: ±10%