Material:
FR-4
FR-5
CEM Series
Polyimide
Teflon/Duroid
Metal Core and Thermal Clad
Getek , Kevlar, Aramid
Roger's
Ask about Special Combination
Special Technologies:
Electroless Silver and Gold
3 Mil Line / 3 Mil Space
12 Mil Pitch
Thin Multilayered up to 0.015"
Small Holes to 0.008"
Surface Mount and Through Hole
BGA, PCMCIA
Bright Tin/Lead Process
Blind/Buried vias
Controlled Impedance / Dielectric
Heat Sinks
Carbon Ink, Epoxy Filled
Finish:
SMOBC
Hot Air Solder Level
Nickel/Gold, Full Selective
Carbon Ink
Immersion Tin
