Semiconductor packaging substrate custom manufacturing— glass, ceramics, silicon and metal

Nowadays, more and more different materials are applied to semiconductor packaging, beside traditional silicon, silicon carbide and other semiconductor materials. We are experienced to provide customized substrate for this application, customized size and thickness of different material such as glass, quartz for MEMS, ceramics for membrance circuits, and all kinds of metail for new packaging methods.

Silicon, silicon carbide, GaN: