layer:1
meterial:FR-4
board thickness:1.6mm
copper thickness:35um
surface:Immesion Gold
solder mask:Green
legend:white
test:100%
the information about our company's process capacity hereinafter for you to reference.
number of layer:1-10
board thickness:0.2mm-3.2mm
copper thickness:1/2OZ min 3OZ max
min wire width/space:0.1mm(4mil)
min aperture of drilled hole:0.2mm(8mil)
surface:HASL,Lead free HASL,Flash Gold ,Immesion Gold ,OSP ,IMMESION Sliver