The Features of WDS-620 bga rework station :
1.HD Optical alignment system for precisely mounting BGA and components
2.Touch screen and PLC controlling to ensure it work stably and reliably.
3.Components mounting accuracy within 0.01mm , Repair success rate 99.9%
4.Laser Positioning function for fast positioning the BGA Chip and motherboard
5.Precise Temperature Control, accuracy within 2℃
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Upper temperature zone can be moved freely, Second zone can be adjusted up and down.
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Three temperature zones to heat up independently.
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Hot air nozzle can be rotated in 360 degree
9.Perfect support Soldering, Desoldering, Removing and Reballing the BGA Chip
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Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc
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With CE certification, double over temperature protection function
The Parameter of bga rework station :
Place of OriginGuang dong , China
Brand Name WDS
Moed Number
WDS-620 bga rework station
Superior function Can create relevant temp,curves according to chips size
Power AC 220V±10% 50/60Hz
Total Power 4800W
Heater power
upper temp.zone 800w, second temp.zone 1200w, IR teom.zone 2700w
Temperature Controlling K-type thermocouple close-loop control,independent temp.controller, the precision can reach ±1℃
PCB size Max:370380mm Min:1010mm
Applicable chips
Max: 80*80mm Min 1x1mm
Thermocouple Ports 1 units
