Automatic Glue Tape Applicator YGA-1000 is designed for pasting the glue tapes onto the punched INLAY middle sheets in the process of INLAY production. The pasted glue tapes are used for temporarily sticking the chips for chip bonding process. It can greatly lower the needed labor power.
Key Features:
PLC is applied to control the machine operation with friendly man-machine interface.
Automatic sheet pick-placing system is applied in the machine.
Dual-interface card INLAY sheets can be processed with this machine.
Custom-made layout of INLAY sheets to be processed is available.
Technical specification
Power supply AC 220V 50/60 HZ Control method PLC + touch screen
Total power 1.5 KW Sheet layout 55,38, 4*8, etc
Air source 6kg/cm2 (dry) weight Approx 300 Kg
Dimension
L2000xW680xH1350 mm
Speed 800-1000 sheets/h as per different layout.