1) Single sided up to 30 Layers, 0.3-5mm thick, 1-10 oz copper.
2) High Tg 170, High CTI 600V
3) Impedance control: Minimum 50 ohm +/-10%. Min. track/space in
inner layer: 4/4mil (1oz), out layer 5/5 mil (1oz)
4) 1+N+1 HDI, laser drill 4 mil(0.1mm), Buried/blind vias
5) Half hole, Via in pad, countersink hole
6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask
7) Small to medium volume, No MOQ.
8) Quick turn around prototypes.
9) mixed material PCB (ROGERS + FR4, Aluminium +FR4)
