Thickness: 0.8 to 3.0mm
Hole size: 0.1mm (4-mil) (minimum)
Line width/space: 0.1mm (4-mil) (minimum)
Special technique: blind and buried via + impedance control
Material: rigid PCB (FR4, CEM-3, aluminum, metal core PCB)
Board thickness: 0.8 to 3mm
Surface treatment: HASL/ HASL lead-free, LF-HASL, HAL, chemical tin, chemical gold, Immersion: silver/gold, OSP, gold plating
High TG and frequency
Twist and warp:
0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFP and BGA
SMT: 0201, 0402, 0603, 0805, 1008, 1206 and 1210
DIP pitches through hole down to 0.60mm
Solder components to underside of board without disrupting topside
Inspection online for AOI and ICT test
X-ray inspection for BGA
High-precision e-testing includes ICT inline, function test, full experienced QC and QA engineer
With RoHS Directive-compliant
