Thickness: 0.8 to 3.0mm
Hole size: 0.1mm (4-mil) (minimum)
Line width/space: 0.1mm (4-mil) (minimum)
Special technique: blind and buried via + impedance control
Material: rigid PCB (FR4, CEM-3, aluminum, metal core PCB)
Board thickness: 0.8 to 3mm
Surface treatment: HASL/ HASL lead-free, LF-HASL, HAL, chemical tin, chemical gold, Immersion: silver/gold, OSP, gold plating
High TG and frequency
Twist and warp: