Fully Automated Screen Printers with 2-D vision.
Inline 3-D Solder Paste Inspection (SPI).
Fully Automated Pick and Place Equipment capable of placing 01005 chip components and micro-BGA’s.
Automated Optical Inspection (AOI) is performed on all surface mount components.
Off line programming and quick change feeders allow for the utmost efficiency and flexibility in job change over.
3-D X-Ray for BGA and QFN components.
Quick-change feeders for job flexibility.
Dedicated lead and lead-free Selective Solder and Wave Solder equipment.
