Base material: aluminum
Layer count: single-sided
Board thickness: 1.60mm
Copper thickness: 1oz
Surface finish: immersion gold
Solder mask color: black
Size: 40 x 40mm
Others:
Available base materials: FR4, aluminum
Minimum copper thickness: 0.5oz
Maximum copper thickness: 4oz
Minimum board thickness: 0.2mm
Maximum board thickness: 3.2mm
Surface finishes: HAL, ENIG, OSP, gold finger and chemistry tin
Possible solder mask colors: green, black, white, yellow and blue
Board dimensions: 600 x 1,000mm
Minimum hole diameter: 0.2mm
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Minimum SMT pitch: 30°
Minimum annular ring: 0.05mm
Aspect ratio: 11:01
Surface/hole plating tolerance:
Hole tolerance (PTH): 0.25mm
Hole tolerance (NPTH): 0.15mm
SM tolerance (LPI)
With electrical test
Compliant with RoHS Directive
SMT device mounting is available
