Base materials: FR4, aluminum, FPC and copper
Minimum copper thickness: 0.5oz
Maximum copper thickness: 4oz
Minimum board thickness: 0.2mm
Maximum board thickness: 3.2mm
Surface finishing: HAL, ENIG, OSP, gold finger, chem and tin
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1,000mm
Minimum hole diameter: 0.2mm
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Minimum SMT pitch: 30°
Minimum annular ring: 0.05mm
Aspect ratio: 11:01
Hole tolerance:
PTH: 0.25mm
NPTH: 0.15mm
